microwaves

.gitignore

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+*.aedtresults
+*.lock
+*.csv

README.MD

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+# Simulation of RF crossover
+
+This is my first simulation in Ansys HFSS and there are some flaws I haven't fixed such as stub pads missing from the internal ground vias on the power plane.
+
+<center><img src="assets/2023-07-13-22-24-58.png" width=400px></center>
+
+A signal allows microwave traces to cross over each other by going through a via.
+
+The properties of a good crossover are:
+
+1. Good isolation between the traces crossing over
+2. Low insertion loss for each of the traces
+
+Vias are an issue as they present a discontinuity for the signal, and may result in an impedance mismatch resulting in increase in insertion loss and reflected power.
+
+There is some amount of coupling between the two traces, which result in crosstalk.
+
+I've made the following design considerations for manufacturing:
+
+1. No blind vias or back-drilled vias. This is to reduce manufacturing cost and allow the device to be manufactured by JLCPCB.
+2. JLCPCB 4 layer 7628 impedance controlled stackup
+3. 1 - Ground/Signal plane, 2 - Ground plane, 3 - Power plane, 4 - Ground/Signal plane
+4. 50 ohm impedance
+
+I recommend you watch the following video series for an example of how to design a microwave crossover device in ansys. I used the series as a reference for my own design.
+
+[![ Design and 3D Modeling of Microwave RF-RF Crossover Device, Part-1 ](https://img.youtube.com/vi/foii4ioCV48/0.jpg)](https://www.youtube.com/watch?v=foii4ioCV48)